Waterproofing and insulation of substrates and sensors.
Dustproof and waterproof technology for electronic components in IoT.
Nakatani's hot melt molding technology is different here. 1. Pioneer of low-temperature and low-pressure molding 2. Diverse specialized materials 3. Thin-walled molding that cannot be achieved with potting methods 4. Waterproofing technology (functional enhancement) 5. Product reliability
- Company：中谷産業
- Price：Other
